HRG300A
Fully automatic High Rigid Grinder for wafers up to 300 mm
For ultra-hard wafer materials
Highest Grinding Speed
In the process measurement of the wafer thickness
Automatic Dressing Function
Highest Grinding Speed
In the process measurement of the wafer thickness
Automatic Dressing Function
- Ideal for processing individual 300 mm wafers and batch grinding for wafers with a smaller diameter
- High precision for extremely hard materials such as CiC, Sapphire, LiNb, Lithium Tantalate (TTV smaller than 0.5 µm/WTW thinner than +-1 µm)
- High stability – for shorter preparation times, less grinding damage and individual, separate Self Sharpening Function
- It extends the lifespan of the grinding stone
- With an In-Process measuring instrument which is batch compatible and measures the wafer thickness during processing in piles
- Inspects the clogging of the grindstone and performs dressing if required
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