HRG200 X
Fully automatic High Rigid Grinder for wafers up to 200 mm
High speed
High Degree of Process Security
Automatic Cleaning Function
High Degree of Process Security
Automatic Cleaning Function
- Double axis
- Less grinding damage, shorter processing times
- Low Costs
- High Precision
- Surface Grinding with Mirror Finish
- Integrated cleaning unit that prevents silicon dust drying on the wafer surface
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