W-GM-4200
Edge grinding machine for wafer manufacturing up to 200 mm
Wide Scope of Application
High Grinding Precision
Compact Design
Easy to Operate
High Grinding Precision
Compact Design
Easy to Operate
- Suitable for various wafer materials, for example GaAs, SiC, GaN etc.
- Newly developed Grinding Unit for better rotational precision of the spindle and the profile sharpness
- non-contact measurement technology ensures stable alignment
- Performs a non-contact measurement of the wafer thickness at numerous different locations before grinding
- Performs a non-contact measurement of the diameter and the indent depth
- Mirror Finish Technology to reduce grinding damage
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