HRG300
Semi-automatic High Rigid Grinder for wafers up to 300 mm
For ultra-hard wafer materials
Highest grinding speed
In the process measurement of the wafer thickness
Automatic Dressing Function
Highest grinding speed
In the process measurement of the wafer thickness
Automatic Dressing Function
- Ideal for processing individual 300 mm wafers and batch grinding for wafers with a small diameter
- Also available for numerous special applications, such as MEMS wafer handling
- High stability – for shorter preparation times, less grinding damage and individual, separate Self Sharpening Function
- It extends the lifespan of the grinding stone
- With the In-Process measuring instrument, which is also suitable for wafer processing in piles and which measures the wafer thickness during the procedure
- Inspects the clogging of the grindstone and performs dressing if required
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